IPC 2221 Generic Standard On Printed Board Design.pdf ((NEW))
IPC 2221 Generic Standard On Printed Board Design.pdf
This standard is a design guide and includes a referenced design and fabrication process to provide a higher design yield and wider variety of PCB design options. It provides criteria for the evaluation of printed board assemblies, single- and double-sided, single- and multilayer printed circuit boards. At the heart of the standard is the basic requirements for printed boards. The IPC-2221B-12 PG DB provides a referenced design process for single-sided and double-sided printed circuit boards. It introduces a series of new requirements, such as a reference geometry for printed circuit boards, the use of generic features, reference design, and reference geometries.
The IPC standards are generally covered by the Organic Materials Protection Act (OMPAA) of which a major provision is that PCBs fabricated from organic materials shall not be used in consumer products or medical devices intended to come into direct contact with human tissues or fluids, unless the board manufacturer has determined that the material meets specific requirements under the OMPAA.
IPC-2221 specifies requirements for the design of printed wiring boards for the many and varied applications that can use low-voltage/low-power products with low component density. The components may be passive or active. To design for such applications, use the organic materials that are the best choice for the application. Power components may require a higher set of standards.
Such products are usually tested as required by the legislation to which the components are applicable to. If required by legislative requirements, the printed wiring board fabrication procedures should be a standard procedure. IPC-2221 was written to describe a generic board type that can be used to accomplish the broad spectrum of electronic products that use organic materials. The standards listed are all directly applicable to products specified.
The coming year, IPC introduced the new IPC-2221 standard, which included a complete revision of the standard design format for printed circuits. The standard facilitates a common search tool for manufacturers and their customers looking for printed wiring board engineers. The IPC website is also the best source for learning about the manufacturing process and the use of circuit board technology in electronic devices. For example, the site has a section on Surface Mount Devices, which includes details on connectors, surface mount technology and placement. The website also has information on PCB design and manufacturing.
The next few years of IPCs history saw the organization sponsor many technical conferences, trade shows and international events related to printed wiring board design, manufacturing and testing. IPC also continued to sponsor top-tier educational events, such as the IPC Foundation Forum, which attracted more than 40 delegates from across the electronics industry.
IPC-2222.3 was adopted by IPC in 1990. This amendment includes a comprehensive set of IPC standards for electrically conducting solder, for supporting solder reflow, for fully covered-filling tin plating, for reinforced solder mask layers, and for standard dimensional specifications for conductive panels. IPC-2222.4 was adopted in 1993 to provide specific standards for PCB assembly. By the early 1990s, there was also a surge in industry interest in doing PCB design in an electronically computerized design environment. These factors led to the adoption of IPC-2221 in 1990. At that time, when there were relatively few PCB design programs on the market, IPC was the most respected organization to develop standards for printed circuit board design. By offering a set of relatively simple and uniform design rules, such as the use of unique identifiers, there was a significant speed and cost benefit for software developers. Later, as the number of commercial PCB design software packages grew, this same IPC-2221 set of design rules became industry standard.
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